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西安尚平电子科技有限公司
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Style FC - Flip Chip version for surface mount applications.
Style WB - Wire Bond version for hybrid applications with metallized back
surface for solder down heat sinking of the chip, includes bondable termination
pads to receive aluminum wire bonds.
• Thermal resistance is provided to optimize high power designs when utilizing
higher thermal conductivity circuit board substrates such as IMS or Alumina.
• Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%,
and 0.10 ohm at ±1%.
• Low inductance provides excellent high frequency and pulse response.
• High pulse handling and overload capability.
• Best choice for switching power supplies, motor speed controls, and high
current sensing applications
Style WB - Wire Bond version for hybrid applications with metallized back
surface for solder down heat sinking of the chip, includes bondable termination
pads to receive aluminum wire bonds.
• Thermal resistance is provided to optimize high power designs when utilizing
higher thermal conductivity circuit board substrates such as IMS or Alumina.
• Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%,
and 0.10 ohm at ±1%.
• Low inductance provides excellent high frequency and pulse response.
• High pulse handling and overload capability.
• Best choice for switching power supplies, motor speed controls, and high
current sensing applications