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西安尚平电子科技有限公司
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Note 1: General Applications - The power rating for
general applications is based upon 0.5 sq. in. (300
mm2
) of termination pad or trace area (2 oz. copper)
connected to each end of the resistor. Maximum chip
temperature is 150°C. Use Derating Curve to derate
appropriay for the maximum ambient temperature
and for the temperature limitations of the adjacent
materials.
Note 2: Thermal Resistance - In High Power Applications where the circuit board material
provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of
the chip resistor is useful to establish the maximum power capability of the chip resistor in the
application. The film temperature is measured at the center of the resistor element and solder
pad temperature at the center of the solderable pedestal (point X in the recommended circuit
layout shown below). Maximum temperature of the chip resistor (at the center of chip) should
not exceed 150°C through the temperature range of the application.
Style FC Derating Curve For General Applications
AMBIENT TEMPERATURE, C
RATED LOAD, %
o
100
80
60
40
20
0
0
C = Current connection
S = Sense connection
Note: Actual width of current trace is based on
magnitude of current. Point of connection should
be
general applications is based upon 0.5 sq. in. (300
mm2
) of termination pad or trace area (2 oz. copper)
connected to each end of the resistor. Maximum chip
temperature is 150°C. Use Derating Curve to derate
appropriay for the maximum ambient temperature
and for the temperature limitations of the adjacent
materials.
Note 2: Thermal Resistance - In High Power Applications where the circuit board material
provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of
the chip resistor is useful to establish the maximum power capability of the chip resistor in the
application. The film temperature is measured at the center of the resistor element and solder
pad temperature at the center of the solderable pedestal (point X in the recommended circuit
layout shown below). Maximum temperature of the chip resistor (at the center of chip) should
not exceed 150°C through the temperature range of the application.
Style FC Derating Curve For General Applications
AMBIENT TEMPERATURE, C
RATED LOAD, %
o
100
80
60
40
20
0
0
C = Current connection
S = Sense connection
Note: Actual width of current trace is based on
magnitude of current. Point of connection should
be